In this work, N-(4-(N-acetylsulfamoyl)phenyl)-2-benzoyl-3-oxo-3-phenylpropanamide (HL) was synthesized by treating the appropriate dibenzoylaceticacid-N-carboxyethylamide with N-(4-aminophenyl)sulfonylacetamide and also characterized by using various analytical and spectroscopic techniques. Further, six metal complexes were synthesized from Zn(II), Ni(II), Mn(II), Cu(II), Co(II), and Pd(II) acetate and ligand in 1:2 ratio respectively. While Cu(II) and Pd(II) complexes exhibited square planar geometry, the others displayed octahedral geometry. Newly synthesized compounds were performed for antioxidant, DNA cleavage and antimicrobial activities. Tested compounds exhibited great potential antioxidant activity, especially Zn and Pd complexes. DNA cleavage results indicated that DNA could cleave with compounds through interaction. These compounds were investigated for their antimicrobial activity against seven microorganism species and showed moderate antimicrobial activity.
Presidency of Scientific Research Projects of University Gaziantep
FEF.YLT.16.06
Yeni karboksamid ligand N-(4-(N-asetilsülfamoil)fenil)-2-benzoil-3-okso-3-fenilpropanamit (HL) ve Zn(II), Ni(II), Mn(II), Cu(II), Co(II) ve Pd(II) kompleksleri sentezlenmiş ve çeşitli analitik ve spektroskopik teknikler kullanılarak karakterize edilmiştir. Cu (II) ve Pd (II) kompleksleri kare düzlem geometri sergilerken, diğerleri oktahedral geometri sergilemiştir. Yeni sentezlenen bileşiklerin, antioksidan, DNA bölünmesi ve antimikrobiyal aktiviteleri incelenmiştir. Test edilen bileşikler, özellikle Zn ve Pd kompleksleri, büyük potansiyel antioksidan aktivite sergilemiştir. DNA bölünmesi sonuçları, DNA'nın etkileşim yoluyla bileşiklerle parçalanabileceğini göstermiştir. Bu bileşikler, yedi mikroorganizma türüne karşı antimikrobiyal aktiviteleri açısından araştırılmış ve orta düzeyde antimikrobiyal aktivite gösterdiği bulunmuştur.
FEF.YLT.16.06
Primary Language | English |
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Subjects | Engineering |
Journal Section | Makaleler |
Authors | |
Project Number | FEF.YLT.16.06 |
Publication Date | August 31, 2021 |
Published in Issue | Year 2021 Volume: 14 Issue: 2 |